| PART |
Description |
Maker |
| BC75-12 |
Absorbent Glass mat technology for efficient gas recombinatino
|
B. B. Battery Co., Ltd.
|
| HDG320240 320240 |
Chip On Glass technology 320 X 240 Dots Graphics
Chip On Glass technology 在玻璃芯片技
|
List of Unclassifed Manufacturers
ETC[ETC]
Hantronix,Inc
Electronic Theatre Controls, Inc.
|
| 71607-302ALF 71607-402ALF 71607-340ALF 71607-440AL |
2 CONTACT(S), FEMALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SURFACE MOUNT, RECEPTACLE
HOUSIN MAT: THERMOPLASTIC GLASS FILLED
|
http://
FCI connector
|
| HDG12864F-1 |
Chip On Glass Technology
|
Hantronix,Inc
|
| LEAQ9WP-KZLZ-1 Q65110A9145 |
Compact light source in SMT technology, glass window on top, RoHS compliant...
Compact light source in SMT technology, glass window on top, RoHS compliant...
|
OSRAM GmbH
|
| TSOP1840SF1 TSOP18SF1 TSOP1856SF1 TSOP1830SF1 TSOP |
Chip-on-Glass (COG) Technology, 16 Characters x 2 Lines 图片模块PCM的远程控制系
From old datasheet system
Photo Modules for PCM Remote Control Systems
|
Vishay Intertechnology, Inc.
Vishay Intertechnology,Inc.
VISAY[Vishay Siliconix]
TFUNK[Vishay Telefunken]
|
| 33482-0402 33482-0403 33482-0408 33482-0417 33482- |
MX150 2X2 BLADE SEALED ASSEMBLY MAT SEAL
|
Molex Electronics Ltd.
|
| PIC18F4580-I_ML PIC18F4580-I_P PIC18F4580-I_PT PIC |
28/40/44-Pin Enhanced Flash Microcontrollers with ECAN Technology, 10-Bit A/D and nanoWatt Technology
|
Microchip Technology
|
| PIC18F4680 PIC18F2585 PIC18F2585_07 PIC18F2680 PIC |
Enhanced Flash Microcontrollers with ECAN Technology, 10-Bit A/D and nanoWatt Technology
|
MICROCHIP[Microchip Technology]
|
| 0643193219 64319-3219 |
.635mm (.025), 1.50mm (.059) CMC Receptacle, 32 Circuits, Right Wire OutputBrown Coding, Mat Sealed
.635mm (.025"), 1.50mm (.059") CMC Receptacle, 32 Circuits, Right Wire OutputBrown Coding, Mat Sealed
MOLEX Connector
|
Molex Electronics Ltd.
|
| ML9041-XXBCVWA |
17 X 100 DOTS DOT MAT LCD DRVR AND DSPL CTLR, UUC175
|
LAPIS SEMICONDUCTOR CO LTD
|
